Troubleshooting Techniques of Complex Multi-Layered PCBs

Authors

  • Mirza Salman Baig University of Karachi, Karachi, Pakistan
  • Ambreen Insaf University of Karachi, Karachi, Pakistan

DOI:

https://doi.org/10.6000/1927-5129.2012.08.02.33

Keywords:

 Technology, functional supportability, foreign Original Equipment Manufacturer, commercial systems, repair of Printed Circuit Board.

Abstract

In this modern era where technology is rapidly changing and is being advanced day by day, Pakistan is dependent on foreign OEM (Original Equipment Manufacturer) for the functional supportability of the systems because most of the commercial and non-commercial systems are foreign OEM based. In the case of any defect of the systems and to reduce the dependency on OEM, the simplest way is to troubleshoot the PCBs (Printed Circuit boards) of the system locally instead of purchasing new PCB or sending it back to OEM for repair until we are able to design our own systems. Thus, it won’t be wrong saying “time, tide and technology wait for none”. The purpose of this research is to achieve self-reliance in PCB troubleshooting, thereby reducing dependability on foreign OEMs, equipment downtime and high costs being acquired in PCB repairs, secondly to highlight the importance of this field so that universities may adopt it as a subject. This research paper is based on some troubleshooting techniques for repair of complex multilayered PCBs.

References

Barton, D.K Radar System Analysis and Modelling, Artech house, Norwood, MA, 2005.

MEL Systems and Services Ltd., known fondly among customers as MEL or MELSS. Training Programme on diagnosis and trouble-shooting of PCBs. Available: http://www.melssindia.com/aststraining.htm

Ahmad Perdous Hasan 2008. Troubleshoot Electronic Components Techniques. Available: http//www.articleslash.com/authorAhmad_Perdous_Hasan

Thermal Imaging Applications. Available: www.palmerwahl.com

Applications for Thermal Imagers: Printed circuit boards. Available: www.fluke.com/thermography

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Published

2021-07-02

How to Cite

Mirza Salman Baig, & Ambreen Insaf. (2021). Troubleshooting Techniques of Complex Multi-Layered PCBs. Journal of Basic & Applied Sciences, 8(2), 456–462. https://doi.org/10.6000/1927-5129.2012.08.02.33

Issue

Section

Physics